LOCTITE® ABLESTIK 2030SC
Známe ako ABLEBOND 2030SC (45G)
Vlastnosti a výhody
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
| Aplikácia | Pripevnenie formy |
| Extrahovateľný iónový obsah, Chlorid (CI-) | 19.0 ppm |
| Extrahovateľný iónový obsah, Draslík (K+) | 4.0 ppm |
| Extrahovateľný iónový obsah, Sodík (Na+) | 29.0 ppm |
| Modul v ťahu, @ 250.0 °C | 450.0 N/mm² (65000.0 psi ) |
| Pevnosť v strihu RT, 2 x 2 mm Si die on Pd | 1.9 kg-f |
| Pevnosť v strihu za tepla | 0.96 kg-f |
| Spôsob vytvrdzovania | Vytvrdzovanie teplom |
| Tixotropný index | 4.6 |
LOCTITE® ABLESTIK 2030SC
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.