LOCTITE® ABLESTIK 2030SC

Tuntud kui ABLEBOND 2030SC (45G)

Omadused ja eelised

This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
Lugege rohkem

Tehniline teave

Ekstraheeritav ioonisisu, Kaalium (K+) 4.0 ppm
Ekstraheeritav ioonisisu, Kloriid (CI-) 19.0 ppm
Ekstraheeritav ioonisisu, Naatrium (Na+) 29.0 ppm
Kuumlõike nihkejõud 0.96 kg-f
RT kuumlõike nihkejõud, 2 x 2 mm Si die on Pd 1.9 kg-f
Rakendused Stantskinnitus
Tahkumistüüp Kuumkõvenemine
Tiksotroopne indeks 4.6
Tõmbemoodul, @ 250.0 °C 450.0 N/mm² (65000.0 psi )