LOCTITE® ABLESTIK 2030SC
Poznat kao ABLEBOND 2030SC (45G)
Elementi i pogodnosti
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
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Dokumenti i preuzimanja
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Tehnički podaci
| Jonski sadržaj koji se izvlači, Hlorid (Cl-) | 19.0 ppm |
| Jonski sadržaj koji se izvlači, Kalijum (K+) | 4.0 ppm |
| Jonski sadržaj koji se izvlači, Natrijum (Na+) | 29.0 ppm |
| Modul elastičnosti, @ 250.0 °C | 450.0 N/mm² (65000.0 psi ) |
| Primene | Dodavanje boje |
| Sila smicanja RT kalupa, 2 x 2 mm Si die on Pd | 1.9 kg-f |
| Sila smicanja vrućeg kalupa | 0.96 kg-f |
| Tiksotropni indeks | 4.6 |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
LOCTITE® ABLESTIK 2030SC
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.