LOCTITE® ABLESTIK 2030SC

被稱為 ABLEBOND 2030SC (45G)

功能與優點

This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
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技術資訊

RT 模剪切強度, 2 x 2 mm Si die on Pd 1.9 kg-f
可萃取出的離子含量, 氯化物(CI-) 19.0 ppm
可萃取出的離子含量, 鈉(Na+) 29.0 ppm
可萃取出的離子含量, 鉀(K+) 4.0 ppm
固化類型 熱固化
應用 晶片焊接
拉伸模量, @ 250.0 °C 450.0 N/mm² (65000.0 psi )
熱模剪切強度 0.96 kg-f
觸變指數 4.6