LOCTITE® ABLESTIK 2030SC
被称为 ABLEBOND 2030SC (45G)
功能与优点
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
了解更多
技术信息
| RT 模剪切强度, 2 x 2 mm Si die on Pd | 1.9 kg-f |
| 可萃取出的离子含量, 氯化物 (CI-) | 19.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 29.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 4.0 ppm |
| 固化方式 | 热+紫外线 |
| 应用 | 芯片焊接 |
| 拉伸模量, @ 250.0 °C | 450.0 N/mm² (65000.0 psi ) |
| 热模剪切强度 | 0.96 kg-f |
| 触变指数 | 4.6 |
LOCTITE® ABLESTIK 2030SC
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.