LOCTITE® ABLESTIK 2030SC
Zināms kā ABLEBOND 2030SC (45G)
Iezīmes un ieguvumi
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
Apraksts
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Tehniskā informācija
| Iegūstamais jonu saturs, Hlorīds (CI-) | 19.0 ppm |
| Iegūstamais jonu saturs, Kālijs (K +) | 4.0 ppm |
| Iegūstamais jonu saturs, Nātrijs (Na +) | 29.0 ppm |
| Karstā spiedogabīdes izturība | 0.96 kg-f |
| Pielietojumi | Spiedoga pievienošana |
| RT spiedoga bīdes izturība, 2 x 2 mm Si die on Pd | 1.9 kg-f |
| Sacietināšanas veids | Sacietināšana karsējot |
| Stiepes modulis, @ 250.0 °C | 450.0 N/mm² (65000.0 psi ) |
| Tiksotropiskais indekss | 4.6 |
LOCTITE® ABLESTIK 2030SC
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.