LOCTITE ECCOBOND UF 3912
fitur dan keuntungan
LOCTITE ECCOBOND UF 3912, Halogen-free, Epoxy, Underfill, Encapsulant
LOCTITE® ECCOBOND UF 3912 underfill is specially designed for flip chip device applications.
- Snap curable
- One component
- Halogen free
- Fast flow
Dokumen dan Unduhan
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Informasi Teknis
| Aplikasi | Enkapsulasi, Kurang Pengisian |
| Jadwal Pengerasan, @ 160.0 °C | 7.0 min. |
| Koefisien Muai Termal (CTE), Above Tg | 105.0 ppm/°C |
| Koefisien Muai Termal (CTE), Below Tg | 28.0 ppm/°C |
| Modulus Penyimpanan, DMA @ 25.0 °C | 8100.0 N/mm² |
| Suhu Penyimpanan | -40.0 °C |
| Suhu Transisi Kaca (Tg) | 127.0 °C |
| Teknologi | Epoxy |
| Tipe Pengeringan | Heat Cure |
| Viskositas, Brookfield CP51, @ 25.0 °C Speed 20 rpm | 3500.0 mPa.s (cP) |
| Warna | Hitam |
LOCTITE ECCOBOND UF 3912
LOCTITE ECCOBOND UF 3912, Halogen-free, Epoxy, Underfill, Encapsulant