LOCTITE® ECCOBOND UF 3912

Features and Benefits

LOCTITE ECCOBOND UF 3912, Halogen-free, Epoxy, Underfill, Encapsulant
LOCTITE® ECCOBOND UF 3912 underfill is specially designed for flip chip device applications.
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Technical Information

Applications Encapsulating, Underfilling
Coefficient of thermal expansion (CTE), Above Tg 105.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 28.0 ppm/°C
Color Black
Cure schedule, @ 160.0 °C 7.0 min.
Cure type Heat cure
Glass transition temperature (Tg) 127.0 °C
Storage modulus, DMA @ 25.0 °C 8100.0 N/mm²
Storage temperature -40.0 °C
Viscosity, Brookfield CP51, @ 25.0 °C Speed 20 rpm 3500.0 mPa·s (cP)