COVID-19 Update

Henkel corporate provides some information regarding Henkel and COVID-19.

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Features and Benefits

LOCTITE ECCOBOND UF 3912, Halogen-free, Epoxy, Underfill, Encapsulant
LOCTITE® ECCOBOND UF 3912 underfill is specially designed for flip chip device applications.
  • One component
  • Stable electrical performance under thermal/humidity bias
  • Halogen free
  • Snap curable
  • Fast flow
  • High Tg
  • Easy rework
  • High fracture toughness
  • Excellent thermal cycle performance
  • Compatible with most Pb-free solders
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Technical Information

Applications Encapsulating, Underfilling
CTEa1 (Below Tg) 28 ppm/°C
CTEa2 (Above Tg) 105 ppm/°C
Color Black
Cure Schedule Temperature (Step 1) 160
Cure Schedule Temperature Unit (Step 1) °F
Cure Schedule Time (Step 1) 7
Cure Schedule Time Unit (Step 1) min.
Cure Type Heat Cure
Shelf Life Time 274 day
Storage Modulus 1174805.73 psi
Storage Temperature -41 °F
Technology Epoxy
Tg 260.6 °F
Viscosity 3500 mPa.s (cP) Brookfield