LOCTITE® ECCOBOND UF 3513HF
Značajke i prednosti
LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant
LOCTITE® ECCOBOND UF 3513HF epoxy underfill encapsulant is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical and moisture resistant properties for protection of electronic components.
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Tehnički podaci
| Koeficijent toplinske ekspanzije (CTE), Above Tg | 197.7 ppm/°C |
| Koeficijent toplinske ekspanzije (CTE), Below Tg | 60.4 ppm/°C |
| Skladišna temperatura | 2.0 - 8.0 °C |
| Temperatura prelaska u staklo (Tg) | 75.0 °C |
| Tip stvrdnjavanja | Toplinsko stvrdnjavanje |
| Vijek trajanja spremnika | 3.0 dan |
| Viskoznost, Brookfield CP51, @ 25.0 °C Speed 20 rpm | 3300.0 mPa.s (cP) |
| Zakaži stvrdnjavanje, @ 80.0 °C | 30.0 min. |
LOCTITE® ECCOBOND UF 3513HF
LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant