LOCTITE® ECCOBOND UF 3513HF
功能与优点
LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant
LOCTITE® ECCOBOND UF 3513HF epoxy underfill encapsulant is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical and moisture resistant properties for protection of electronic components.
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技术信息
| 使用寿命 | 3.0 天 |
| 储存温度 | 2.0 - 8.0 °C |
| 固化方式 | 热+紫外线 |
| 固化时间, @ 80.0 °C | 30.0 分钟 |
| 热膨胀系数 (CTE), Above Tg | 197.7 ppm/°C |
| 热膨胀系数 (CTE), Below Tg | 60.4 ppm/°C |
| 玻璃化温度 (Tg) | 75.0 °C |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 20 rpm | 3300.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3513HF
LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant