LOCTITE® ECCOBOND UF 3513HF
Elementi i pogodnosti
LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant
LOCTITE® ECCOBOND UF 3513HF epoxy underfill encapsulant is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical and moisture resistant properties for protection of electronic components.
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Tehnički podaci
| Koeficijent toplotnog širenja (CTE), Above Tg | 197.7 ppm/°C |
| Koeficijent toplotnog širenja (CTE), Below Tg | 60.4 ppm/°C |
| Raspored polimerizacije, @ 80.0 °C | 30.0 minuta |
| Temperatura razmekšavanja (Tg) | 75.0 °C |
| Temperatura čuvanja | 2.0 - 8.0 °C |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
| Vek trajanja nakon otvaranja | 3.0 dan |
| Viskoznost, Brookfield CP51, @ 25.0 °C Speed 20 rpm | 3300.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3513HF
LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant