BERGQUIST® HI FLOW THF 1000U

Known as Hi-Flow® 225U

Features and Benefits

BERGQUIST HI FLOW THF 1000U, Non-Reinforced Phase Change Thermal Interface Material
BERGQUIST® HI FLOW THF 1000U is designed for use as a thermal interface material between a computer processor and a heat sink. The product consists of a thermally conductive 55°C phase change compound coated on a release liner and supplied on a carrier. Above its phase change temperature, BERGQUIST HI FLOW THF 1000U wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The material requires pressure of the assembly to cause flow
  • Available in roll form with kiss-cut parts
  • Thermally conductive 55°C phase change compound
  • Hi-Flow® coating will resist dripping
  • Thermal impedance: 0.07ºC-in2 /W @ 25 psi
Read More

Technical Information

Color Black
Flame rating V-0
Operating temperature 150.0 °C
Standard thickness 0.036 mm
Thermal conductivity 0.1 W/mK