BERGQUIST® HI FLOW THF 1000U
Zināms kā Hi-Flow® 225U
Iezīmes un ieguvumi
BERGQUIST HI FLOW THF 1000U, Non-Reinforced Phase Change Thermal Interface Material
BERGQUIST® HI FLOW THF 1000U is designed for use as a thermal interface material between a computer processor and a heat sink. The product consists of a thermally conductive 55°C phase change compound coated on a release liner and supplied on a carrier. Above its phase change temperature, BERGQUIST HI FLOW THF 1000U wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The material requires pressure of the assembly to cause flow
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Tehniskā informācija
Darbības temperatūra | 150.0 °C |
Krāsa | Melna |
Liesmas novērtējums | V-0 |
Siltumvadītspēja | 0.1 W/mK |
Standarta biezums | 0.036 mm |