BERGQUIST® HI FLOW THF 1000U
U svojstvu Hi-Flow® 225U
Značajke i prednosti
BERGQUIST HI FLOW THF 1000U, Non-Reinforced Phase Change Thermal Interface Material
BERGQUIST® HI FLOW THF 1000U is designed for use as a thermal interface material between a computer processor and a heat sink. The product consists of a thermally conductive 55°C phase change compound coated on a release liner and supplied on a carrier. Above its phase change temperature, BERGQUIST HI FLOW THF 1000U wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The material requires pressure of the assembly to cause flow
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Dokumenti i preuzimanja
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Tehnički podaci
| Boja | Crna |
| Jakost plamena | V-0 |
| Radna temperatura | 150.0 °C |
| Toplinska vodljivost | 0.1 W/mK |
| Uobičajena debljina | 0.036 mm |
BERGQUIST® HI FLOW THF 1000U
BERGQUIST HI FLOW THF 1000U, Non-Reinforced Phase Change Thermal Interface Material