LOCTITE® ABLESTIK 965-1L

功能与优点

LOCTITE ABLESTIK 965-1L, Epoxy, Die attach
LOCTITE® ABLESTIK 965-1L is designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion. It is designed for high speed, automated assembly operations.
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技术信息

RT 模剪切强度, 2 x 2 mm (80 x 80 mil) Si die on Ag/Cu LF 10.0 kg-f
体积电阻率 ≤ 0.0005 Ohm cm
固化方式 热+紫外线
固化时间, @ 150.0 °C 1.0 小时
导热性 3.0 W/mK
应用 芯片焊接
热模剪切强度, 2 x 2 mm (80 x 80 mil) Si die on Ag/Cu LF 0.6 kg-f
热膨胀系数 (CTE) 50.0 ppm/°C
热膨胀系数 (CTE), Above Tg 190.0 ppm/°C
玻璃化温度 (Tg) 72.0 °C
粘度,博勒菲 CP51, @ 25.0 °C Speed 5 rpm 12000.0 mPa.s (cP)
触变指数 4.5
颜色