LOCTITE® ABLESTIK 965-1L

Features and Benefits

LOCTITE ABLESTIK 965-1L, Epoxy, Die attach
LOCTITE® ABLESTIK 965-1L is designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion. It is designed for high speed, automated assembly operations.
Read More

Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 50.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 190.0 ppm/°C
Colour Silver
Cure schedule, @ 150.0 °C 1.0 hr.
Cure type Heat cure
Glass transition temperature (Tg) 72.0 °C
Hot die shear strength, 2 x 2 mm (80 x 80 mil) Si die on Ag/Cu LF 0.6 kg-f
RT die shear strength, 2 x 2 mm (80 x 80 mil) Si die on Ag/Cu LF 10.0 kg-f
Thermal conductivity 3.0 W/mK
Thixotropic index 4.5
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 12000.0 mPa·s (cP)
Volume resistivity ≤ 0.0005 Ohm cm