LOCTITE® ECCOBOND FP4530
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LOCTITE ECCOBOND FP4530, Snap curable, Epoxy, Underfill
LOCTITE® ECCOBOND FP4530 underfill is designed for flip chip on flex applications with a 25micron gap. Upon cure, the material color will change from blue to green.
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Tehnične informacije
| Koeficient toplotnega raztezanja (CTE), Above Tg | 150.0 ppm/°C |
| Koeficient toplotnega raztezanja (CTE), Below Tg | 46.0 ppm/°C |
| Temperatura posteklenitve (Tg) | 145.0 °C |
| Urnik strjevanja, @ 160.0 °C | 7.0 min. |
| Viskoznost, Brookfield stožec in plošča, @ 25.0 °C Spindle 52, speed 20 rpm | 3500.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4530
LOCTITE ECCOBOND FP4530, Snap curable, Epoxy, Underfill