LOCTITE® ECCOBOND FP4530
Features and Benefits
This epoxy underfill is specifically designed for flip chip on flex applications with a 25micron gap.
LOCTITE® ECCOBOND FP4530 snap-curable underfill is designed for flip chip on flex applications with a 25micron gap. Upon cure, the material color changes from blue to green.
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 150.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 46.0 ppm/°C |
| Cure schedule, @ 160.0 °C | 7.0 min |
| Glass transition temperature (Tg) | 145.0 °C |
| Viscosity, Brookfield Cone & Plate, @ 25.0 °C Spindle 52, speed 20 rpm | 3500.0 mPa·s (cP) |
LOCTITE® ECCOBOND FP4530
This epoxy underfill is specifically designed for flip chip on flex applications with a 25micron gap.