BERGQUIST® GAP PAD® TGP A2000
Conosciuto come Gap Pad® A2000
Caratteristiche e vantaggi
BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material
BERGQUIST® GAP PAD TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mil, BERGQUIST GAP PAD TGP A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mil material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.
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Informazioni tecniche
| Classe di infiammabilità | V-0 |
| Colore | Grigio |
| Conducibilità termica | 0.2 W/mK |
| Modulo di Young, ASTM D575 | 379.0 KPa (55.0 psi ) |
| Spessore standard | 0.254 - 1.016 mm |
| Temperatura di esercizio | -60.0 - 200.0 °C |
| Tipo carrier | Fibra di vetro |
BERGQUIST® GAP PAD® TGP A2000
BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material