BERGQUIST® GAP PAD® TGP A2000
Známe ako Gap Pad® A2000
Vlastnosti a výhody
BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material
BERGQUIST® GAP PAD TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mil, BERGQUIST GAP PAD TGP A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mil material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.
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Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
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Technické informácie
Farba | Šedá |
Hodnotenie horľavosti | V-0 |
Prevádzková teplota | -60.0 - 200.0 °C |
Tepelná vodivosť | 0.2 W/mK |
Typ nosiča | Sklenené vlákno |
Youngov modul, ASTM D575 | 379.0 KPa (55.0 psi ) |
Štandardná hrúbka | 0.254 - 1.016 mm |