BERGQUIST® GAP PAD® TGP A2000

Conhecido como Gap Pad® A2000

Características e Benefícios

BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material
BERGQUIST® GAP PAD TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mil, BERGQUIST GAP PAD TGP A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mil material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.
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Informação Técnica

Classificação da chama V-0
Condutividade térmica 0.2 W/mK
Cor Cinza
Espessura padrão 0.254 - 1.016 mm
Módulo de Young, ASTM D575 379.0 KPa (55.0 psi )
Temperatura de operação -60.0 - 200.0 °C
Tipo de operadora Fibra de Vidro