BERGQUIST® GAP PAD® TGP A2000
U svojstvu Gap Pad® A2000
Značajke i prednosti
BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material
BERGQUIST® GAP PAD TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mil, BERGQUIST GAP PAD TGP A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mil material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.
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Dokumenti i preuzimanja
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Tehnički podaci
| Boja | Siva |
| Jakost plamena | V-0 |
| Radna temperatura | -60.0 - 200.0 °C |
| Toplinska vodljivost | 0.2 W/mK |
| Uobičajena debljina | 0.254 - 1.016 mm |
| Vrsta nosača | Staklena vuna |
| Youngov modul, ASTM D575 | 379.0 KPa (55.0 psi ) |
BERGQUIST® GAP PAD® TGP A2000
BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material