BERGQUIST® GAP PAD® TGP 2202SF
Conosciuto come Gap Pad® 2202SF
Caratteristiche e vantaggi
BERGQUIST GAP PAD TGP 2202SF is a silicone-free, thermally conductive gap filler material that features a 0.5 mil PET coating on one side and natural tack on the other to eliminate the need for additional adhesive layers.
BERGQUIST® GAP PAD TGP 2202SF is a high-performance gap filling material with a fiberglass center which provides exceptionally low interfacial resistances to adjacent surfaces and its silicone-free design is compatible with silicone-sensitive applications. BERGQUIST GAP PAD TGP 2202SF is available in a variety of sizes and thicknesses. Custom-made configurations are available upon request.
Leggi tutto
Documenti e download
Cerchi una TDS o un SDS in un'altra lingua?
Documenti aggiuntivi
Informazioni tecniche
| Classe di infiammabilità | V-0 |
| Colore | Grigio |
| Conducibilità termica | 2.0 W/mK |
| Costante dielettrica, @ 1kHz | 6.0 |
| Densità | 2.8 g/cm³ |
| Durezza shore, Thirty second delay value, ASTM D2240 Gomma bulk @ 23.0 °C Shore 00 | 70.0 |
| Resistività di volume | 1×10 Ohm m |
| Spessore standard | 0.254 - 3.175 mm |
| Temperatura di esercizio | -40.0 - 125.0 °C |
BERGQUIST® GAP PAD® TGP 2202SF
BERGQUIST GAP PAD TGP 2202SF is a silicone-free, thermally conductive gap filler material that features a 0.5 mil PET coating on one side and natural tack on the other to eliminate the need for additional adhesive layers.