BERGQUIST® GAP PAD® TGP 2202SF
Známé jako Gap Pad® 2202SF
Vlastnosti a výhody
BERGQUIST GAP PAD TGP 2202SF is a silicone-free, thermally conductive gap filler material that features a 0.5 mil PET coating on one side and natural tack on the other to eliminate the need for additional adhesive layers.
BERGQUIST® GAP PAD TGP 2202SF is a high-performance gap filling material with a fiberglass center which provides exceptionally low interfacial resistances to adjacent surfaces and its silicone-free design is compatible with silicone-sensitive applications. BERGQUIST GAP PAD TGP 2202SF is available in a variety of sizes and thicknesses. Custom-made configurations are available upon request.
Oblasti Použití
Dokumenty ke stažení
Hledáte TS nebo BL v jiném jazyce?
Další dokumenty
Technické informace
| Barva | Šedá |
| Dielektrická konstanta, @ 1kHz | 6.0 |
| Hodnocení hořlavosti | V-0 |
| Hustota | 2.8 g/cm³ |
| Objemový odpor | 1×10 Ohm m |
| Provozní teplota | -40.0 - 125.0 °C |
| Standardní tloušťka | 0.254 - 3.175 mm |
| Tepelná vodivost | 2.0 W/mK |
| Tvrdost v jednotce shore, Thirty second delay value, ASTM D2240 Sypká pryž @ 23.0 °C Shore 00 | 70.0 |
BERGQUIST® GAP PAD® TGP 2202SF
BERGQUIST GAP PAD TGP 2202SF is a silicone-free, thermally conductive gap filler material that features a 0.5 mil PET coating on one side and natural tack on the other to eliminate the need for additional adhesive layers.