BERGQUIST® GAP PAD® TGP 2202SF
Známe ako Gap Pad® 2202SF
Vlastnosti a výhody
BERGQUIST GAP PAD TGP 2202SF is a silicone-free, thermally conductive gap filler material that features a 0.5 mil PET coating on one side and natural tack on the other to eliminate the need for additional adhesive layers.
BERGQUIST® GAP PAD TGP 2202SF is a high-performance gap filling material with a fiberglass center which provides exceptionally low interfacial resistances to adjacent surfaces and its silicone-free design is compatible with silicone-sensitive applications. BERGQUIST GAP PAD TGP 2202SF is available in a variety of sizes and thicknesses. Custom-made configurations are available upon request.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Ďalšie dokumenty
Technické informácie
Dielektrická konštanta, @ 1kHz | 6.0 |
Farba | Šedá |
Hodnotenie horľavosti | V-0 |
Hustota | 2.8 g/cm³ |
Objemový odpor | 1×10 Ohm m |
Prevádzková teplota | -40.0 - 125.0 °C |
Tepelná vodivosť | 2.0 W/mK |
Tvrdosť v jednotke Shore, Thirty second delay value, ASTM D2240 Sypká guma @ 23.0 °C Shore 00 | 70.0 |
Štandardná hrúbka | 0.254 - 3.175 mm |