BERGQUIST® GAP PAD® TGP 2202SF
Bekend als Gap Pad® 2202SF
Kenmerken en voordelen
BERGQUIST GAP PAD TGP 2202SF is a silicone-free, thermally conductive gap filler material that features a 0.5 mil PET coating on one side and natural tack on the other to eliminate the need for additional adhesive layers.
BERGQUIST® GAP PAD TGP 2202SF is a high-performance gap filling material with a fiberglass center which provides exceptionally low interfacial resistances to adjacent surfaces and its silicone-free design is compatible with silicone-sensitive applications. BERGQUIST GAP PAD TGP 2202SF is available in a variety of sizes and thicknesses. Custom-made configurations are available upon request.
Meer info
Documenten en downloads
Op zoek naar een TDS of MSDS in een andere taal?
Bijkomende documenten
Technische informatie
| Dichtheid | 2.8 g/cm³ |
| Diëlektrische constante, @ 1kHz | 6.0 |
| Gebruikstemperatuur | -40.0 - 125.0 °C |
| Kleur | Grijs |
| Shore hardheid, Thirty second delay value, ASTM D2240 Bulk Rubber @ 23.0 °C Shore 00 | 70.0 |
| Standaard dikte | 0.254 - 3.175 mm |
| Thermische geleidbaarheid | 2.0 W/mK |
| Vlammenclassificatie | V-0 |
| Volumeweerstandsvermogen | 1×10 Ohm m |
BERGQUIST® GAP PAD® TGP 2202SF
BERGQUIST GAP PAD TGP 2202SF is a silicone-free, thermally conductive gap filler material that features a 0.5 mil PET coating on one side and natural tack on the other to eliminate the need for additional adhesive layers.