BERGQUIST® GAP PAD® TGP 2202SF
Connu sous le nom de Gap Pad® 2202SF
Caractéristiques et avantages
BERGQUIST GAP PAD TGP 2202SF is a silicone-free, thermally conductive gap filler material that features a 0.5 mil PET coating on one side and natural tack on the other to eliminate the need for additional adhesive layers.
BERGQUIST® GAP PAD TGP 2202SF is a high-performance gap filling material with a fiberglass center which provides exceptionally low interfacial resistances to adjacent surfaces and its silicone-free design is compatible with silicone-sensitive applications. BERGQUIST GAP PAD TGP 2202SF is available in a variety of sizes and thicknesses. Custom-made configurations are available upon request.
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Informations techniques
| Conductivité thermique | 2.0 W/mK |
| Constante diélectrique, @ 1kHz | 6.0 |
| Cote d'inflammabilité | V-0 |
| Couleur | Gris |
| Densité | 2.8 g/cm³ |
| Dureté Shore, Thirty second delay value, ASTM D2240 Caoutchouc en vrac @ 23.0 °C Shore 00 | 70.0 |
| Résistivité volume | 1×10 Ohm m |
| Température de service | -40.0 - 125.0 °C |
| Épaisseur standard | 0.254 - 3.175 mm |
BERGQUIST® GAP PAD® TGP 2202SF
BERGQUIST GAP PAD TGP 2202SF is a silicone-free, thermally conductive gap filler material that features a 0.5 mil PET coating on one side and natural tack on the other to eliminate the need for additional adhesive layers.