LOCTITE® 3621
Conosciuto come Chipbonder 3621
Caratteristiche e vantaggi
Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
When you need a surface mount adhesive with very high dispense speed, try LOCTITE® 3621. It is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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Informazioni tecniche
| Aspetto fisico | Gel |
| Casson viscosità, cone & plate Haake PK100, M10/PK1, 2°, @ 25.0 °C | 0.5 - 3.0 Pa∙s |
| Coefficiente di espansione termica (CTE), Above Tg | 100.0 ppm/°C |
| Numero dei componenti | Monocomponente |
| Punto di snervamento, cono e piano, Haake PK100, M10/PK1, 2°, @ 25.0 °C | 130.0 - 280.0 Pa∙s |
| Resistenza al taglio, Acciaio (sabbiato) | 2175.0 psi |
| Schema di polimerizzazione, @ 150.0 °C | 90.0 - 120.0 sec. |
| Temperatura di stoccaggio | 2.0 - 8.0 °C |
| Tipo di polimerizzazione | Polimerizzazione a caldo |
LOCTITE® 3621
Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.