LOCTITE® 3621
旧名称 Chipbonder 3621
特長および利点
Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
When you need a surface mount adhesive with very high dispense speed, try LOCTITE® 3621. It is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
詳細はこちら
技術情報
| Casson粘度、コーン＆プレート Haake PK100, M10/PK1, 2°, @ 25.0 °C | 0.5 - 3.0 パスカル秒 |
| せん断強度, 鋼（グリットブラスト） | 2175.0 psi |
| 保存温度 | 2.0 - 8.0 °C |
| 外観 | ゲル |
| 形態 | 1液 |
| 熱膨張率, Above Tg | 100.0 ppm/°C |
| 硬化スケジュール, @ 150.0 °C | 90.0 - 120.0 秒 |
| 硬化タイプ | 熱硬化 |
| 降伏点、コーンプレート、Haake PK100、M10/PK1、2°, @ 25.0 °C | 130.0 - 280.0 パスカル秒 |
LOCTITE® 3621
Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.