LOCTITE® 3621
U svojstvu Chipbonder 3621
Značajke i prednosti
Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
When you need a surface mount adhesive with very high dispense speed, try LOCTITE® 3621. It is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
Dodatne informacije
Dokumenti i preuzimanja
Tražite list s tehničkim podacima ili list sa sigurnosnim podacima na drugom jeziku?
Tehnički podaci
Broj komponenti | 1 dio |
Casson Viskoznost, stošcem i pločom Haake PK100, M10/PK1, 2°, @ 25.0 °C | 0.5 - 3.0 Pa∙s |
Fizički oblik | Gel |
Koeficijent toplinske ekspanzije (CTE), Above Tg | 100.0 ppm/°C |
Skladišna temperatura | 2.0 - 8.0 °C |
Snaga smicanja, Čelik (pjeskaren) | 2175.0 psi |
Tip stvrdnjavanja | Toplinsko stvrdnjavanje |
Točka razvlačenja, stošcem i pločom, Haake PK100, M10/PK1, 2°, @ 25.0 °C | 130.0 - 280.0 Pa∙s |
Zakaži stvrdnjavanje, @ 150.0 °C | 90.0 - 120.0 s |