LOCTITE® 3621

Poznat kao Chipbonder 3621

Elementi i pogodnosti

Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
When you need a surface mount adhesive with very high dispense speed, try LOCTITE® 3621. It is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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Dokumenti i preuzimanja

Tehnički podaci

Broj komponenti 1 deo
Casson viskoznost, kugla / pločae Haake PK100, M10/PK1, 2°, @ 25.0 °C 0.5 - 3.0 Pa∙s
Fizički oblik Gel
Koeficijent toplotnog širenja (CTE), Above Tg 100.0 ppm/°C
Raspored polimerizacije, @ 150.0 °C 90.0 - 120.0 sekunda
Sila smicanja, Čelik (peskirani) 2175.0 psi
Tačka razvlačenja, kugla / ploča, Haake PK100, M10/PK1, 2°, @ 25.0 °C 130.0 - 280.0 Pa∙s
Temperatura čuvanja 2.0 - 8.0 °C
Tip očvršćavanja Očvršćavanje pomoću zagrevanja