LOCTITE® 3621
Bekannt als Chipbonder 3621
Merkmale und Vorteile
Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
When you need a surface mount adhesive with very high dispense speed, try LOCTITE® 3621. It is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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Technische Informationen
| Anzahl Komponenten | 1K |
| Aushärtetechnik | Aushärtung durch Wärme |
| Aushärtezyklus, @ 150.0 °C | 90.0 - 120.0 Sek. |
| Casson Viskosität, Kegel-Platte-System Haake PK100, M10/PK1, 2°, @ 25.0 °C | 0.5 - 3.0 Pa∙s |
| Fließgrenze, Cone & Plate, Haake PK100, M10/PK1, 2°, @ 25.0 °C | 130.0 - 280.0 Pa∙s |
| Lagertemperatur | 2.0 - 8.0 °C |
| Physikalische Form | Gel |
| Scherfestigkeit, Stahl (sandgestrahlt) | 2175.0 psi |
| Wärmeausdehnungskoeffizient (CTE), Above Tg | 100.0 ppm/°C |
LOCTITE® 3621
Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.