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      A packshot of LOCTITE 3621 in 2 different sizes showing a red 30CC syringe and 300CC semco cartridge.

      Surface mount adhesives

      LOCTITE® 3621

      Very high dispense speed, electrically non-conductive surface mount adhesive

      Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.

      All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

      Part no. (SKU/IDH)
      235130

      LOCTITE® 3621, 10 ml Syringe

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      Technical (1)

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      Information

      When you need a surface mount adhesive with very high dispense speed, try LOCTITE® 3621. It is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
      • 1-part: no mixing required
      • Very high dispense speed
      • High wet strength
      • Electrically non-conductive

      Casson viscosity, cone & plate Haake PK100, M10/PK1, 2°, @ 25.0 °C:

      0.5 Pa∙s - 3.0 Pa∙s

      Coefficient of thermal expansion (CTE), Above Tg:

      100.0 ppm/°C

      Cure schedule, @ 150.0 °C:

      90.0 sec. - 120.0 sec.

      Cure type:

      Heat cure

      Number of components:

      1 part

      Physical form:

      Gel

      Shear strength, Steel (grit blasted):

      2175.0 psi

      Storage temperature:

      2.0 °C - 8.0 °C

      Yield point, cone & plate, Haake PK100, M10/PK1, 2°, @ 25.0 °C:

      130.0 Pa∙s - 280.0 Pa∙s

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