LOCTITE® 3621
Zināms kā Chipbonder 3621
Iezīmes un ieguvumi
Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
When you need a surface mount adhesive with very high dispense speed, try LOCTITE® 3621. It is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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Tehniskā informācija
| Bīdes izturība, Tērauds (abrazīvs) | 2175.0 psi |
| Casson viskozitāte, konusa un plātnes mērīšanas sistēma Haake PK100, M10/PK1, 2°, @ 25.0 °C | 0.5 - 3.0 Pa∙s |
| Fizikālā forma | Želeja |
| Komponentu skaits | 1 komponents |
| Plūstamības robeža, konuss un plāksne, Haake PK100, M10/PK1, 2°, @ 25.0 °C | 130.0 - 280.0 Pa∙s |
| Sacietināšanas veids | Sacietināšana karsējot |
| Termiskās izplešanās koeficients (CTE), Above Tg | 100.0 ppm/°C |
| Uzglabāšanas temperatūra | 2.0 - 8.0 °C |
| Ārstēšanas grafiks, @ 150.0 °C | 90.0 - 120.0 sek. |
LOCTITE® 3621
Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.