LOCTITE® ABLESTIK CDF 200
Caratteristiche e vantaggi
LOCTITE ABLESTIK CDF 200, Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK CDF 200 highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It can be used in a variety of die sizes ranging from 0.2mm x 0.2mm to 5mm x 5mm . This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes.
Leggi tutto
Documenti e download
Cerchi una TDS o un SDS in un'altra lingua?
Informazioni tecniche
| Diametro nastro per cubettatura | 8.0 |
| Diametro wafer | 8.0 |
| Modulo di trazione, @ 25.0 °C | 5400.0 N/mm² (783200.0 psi ) |
| Resistenza al taglio matrice calda | 5.2 kg-f |
| Spessore film adesivo | 15.0 µm |
LOCTITE® ABLESTIK CDF 200
LOCTITE ABLESTIK CDF 200, Hybrid Chemistry, Die Attach