LOCTITE® ABLESTIK CDF 200
Features and Benefits
This highly filled conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.
LOCTITE® ABLESTIK CDF 200 is a silver, highly filled, thermally and electrically conductive die-attach adhesive paste for bonding integrated circuits and components to metal substrates. It offers strong adhesion to various wafer metallizations and lead frame finishes and is typically used for QFN, SOIC and SO package applications. It works on various die sizes ranging from 0.2mm x 0.2mm to 5mm x 5mm and is ideal when tight control of resin bleed-out is required. LOCTITE ABLESTIK ABP 8303A is based on hybrid chemistry, cures when exposed to heat and provides a consistent bond line thickness.
- Good for thin wafer handling applications
- Film thickness: 15µm and 30µm
- Offers high MSL reliability
- No resin bleed-out
- Low in-package thermal and electrical resistance
Documents and Downloads
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Technical Information
| Adhesive film thickness | 15.0 µm |
| Dicing tape diameter | 8.0 |
| Hot die shear strength | 5.2 kg-f |
| Tensile modulus, @ 25.0 °C | 5400.0 N/mm² (783200.0 psi ) |
| Wafer diameter | 8.0 |
LOCTITE® ABLESTIK CDF 200
This highly filled conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.