LOCTITE® ABLESTIK CDF 200
Vlastnosti a výhody
LOCTITE ABLESTIK CDF 200, Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK CDF 200 highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It can be used in a variety of die sizes ranging from 0.2mm x 0.2mm to 5mm x 5mm . This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes.
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Technické informace
| Modul v tahu, @ 25.0 °C | 5400.0 N/mm² (783200.0 psi ) |
| Pevnost ve střihu za tepla | 5.2 kg-f |
| Průměr pásky pro řezání | 8.0 |
| Průměr waferu | 8.0 |
| Tloušťka lepicí fólie | 15.0 µm |
LOCTITE® ABLESTIK CDF 200
LOCTITE ABLESTIK CDF 200, Hybrid Chemistry, Die Attach