LOCTITE® ABLESTIK QMI546

Elementi i pogodnosti

LOCTITE ABLESTIK QMI546, BMI, Die attach
LOCTITE® ABLESTIK QMI546 die attach adhesive is formulated to cure rapidly below the boiling point of water, preventing steam from creating voids. This product is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives
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Dokumenti i preuzimanja

Tehnički podaci

Koeficijent toplotnog širenja (CTE), Above Tg 190.0 ppm/°C
Koeficijent toplotnog širenja (CTE), Below Tg 80.0 ppm/°C
Primene Dodavanje boje
Temperatura razmekšavanja (Tg) 10.0 °C
Tiksotropni indeks 6.0
Tip očvršćavanja Očvršćavanje pomoću zagrevanja
Toplotna provodljivost 0.2 W/mK
Viskoznost 6500.0 mPa.s (cP)