LOCTITE® ECCOBOND FP4526
Features and Benefits
LOCTITE ECCOBOND FP4526, Epoxy, Underfill
LOCTITE® ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications.
Read More
Documents and Downloads
There are no documents and downloads available for your location and language. You can try searching for a document in another language
Technical Information
Coefficient of thermal expansion (CTE), Above Tg | 101.0 ppm/°C |
Coefficient of thermal expansion (CTE), Below Tg | 33.0 ppm/°C |
Cure schedule, @ 165.0 °C | 15.0 min. |
Flexural modulus | 8500.0 N/mm² (1232500.0 psi ) |
Glass transition temperature (Tg) | 133.0 °C |
Viscosity, Brookfield Cone & Plate, @ 25.0 °C Spindle 52, speed 10 rpm | 4700.0 mPa·s (cP) |