LOCTITE® ECCOBOND E 3200
특징 및 이점
LOCTITE ECCOBOND E 3200, Sag resistant, Flexible, Assembly, Epoxy
LOCTITE® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates.
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기술 정보
| 경화 시간, @ 100.0 °C | 20.0 분 |
| 점도, Brookfield, Speed 10 rpm | 150000.0 mPa.s (cP) |
LOCTITE® ECCOBOND E 3200
LOCTITE ECCOBOND E 3200, Sag resistant, Flexible, Assembly, Epoxy