LOCTITE® ECCOBOND E 3200

Omadused ja eelised

TDS-i allalaadimine
LOCTITE ECCOBOND E 3200, Sag resistant, Flexible, Assembly, Epoxy
LOCTITE® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates.
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Dokumendid ja allalaadimised

Tehniline andmeleht
LOCTITE® ECCOBOND E 3200
Laadige alla TDS

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Tehniline teave

Kõvenemisaeg, @ 100.0 °C 20.0 minut
Viskoossus, Brookfield, Speed 10 rpm 150000.0 mPa.s (cP)