LOCTITE® ECCOBOND E 3200

Merkmale und Vorteile

LOCTITE ECCOBOND E 3200, Sag resistant, Flexible, Assembly, Epoxy
LOCTITE® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates.
Weiterlesen

Technische Informationen

Aushärtezyklus, @ 100.0 °C 20.0 Min.
Viskosität, Brookfield, Speed 10 rpm 150000.0 mPa.s (cP)