LOCTITE® ECCOBOND E 3200
Features and Benefits
LOCTITE ECCOBOND E 3200, Sag resistant, Flexible, Assembly, Epoxy
LOCTITE® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates.
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Documents and Downloads
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Technical Information
| Cure schedule, @ 100.0 °C | 20.0 min. |
| Viscosity, Brookfield, Speed 10 rpm | 150000.0 mPa·s (cP) |
LOCTITE® ECCOBOND E 3200
LOCTITE ECCOBOND E 3200, Sag resistant, Flexible, Assembly, Epoxy