LOCTITE® ABLESTIK ECF 563
特長および利点
LOCTITE ABLESTIK ECF 563, Epoxy Film, Assembly
LOCTITE® ABLESTIK ECF 563 epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in bonding microwave substrates into packages.
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技術情報
| せん断強度, アルミニウム | 2500.0 psi |
| ガラス転移温度 (Tg) | 88.0 °C |
| キャリア膜厚 | 25.0 µm |
| 外観 | フィルム |
| 熱伝導率 | 1.0 W/mK |
| 硬化スケジュール, @ 150.0 °C | 30.0 分 |
| 硬化タイプ | 熱硬化 |
LOCTITE® ABLESTIK ECF 563
LOCTITE ABLESTIK ECF 563, Epoxy Film, Assembly