LOCTITE® ABLESTIK ECF 563
Features and Benefits
LOCTITE ABLESTIK ECF 563, Epoxy Film, Assembly
LOCTITE® ABLESTIK ECF 563 epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in bonding microwave substrates into packages.
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Technical Information
| Carrier film thickness | 25.0 µm |
| Cure schedule, @ 150.0 °C | 30.0 min. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 88.0 °C |
| Physical form | Film |
| Shear strength, Aluminum | 2500.0 psi |
| Thermal conductivity | 1.0 W/mK |
LOCTITE® ABLESTIK ECF 563
LOCTITE ABLESTIK ECF 563, Epoxy Film, Assembly