LOCTITE® ABLESTIK ABP 8066T
Caratteristiche e vantaggi
LOCTITE ABLESTIK ABP 8066T, Hybrid chemistry, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8066T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. The material is hydrophobic and stable at high temperatures. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
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Informazioni tecniche
| Applicazioni | Die attach |
| Coefficiente di espansione termica (CTE) | 53.0 ppm/°C |
| Coefficiente di espansione termica (CTE), Above Tg | 90.0 ppm/°C |
| Conducibilità termica | 15.0 W/mK |
| Indice tixotropico | 6.0 |
| Temperatura di transizione vetrosa (Tg) | 67.0 °C |
| Tipo di polimerizzazione | Polimerizzazione a caldo |
| Viscosità, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 10000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 8066T
LOCTITE ABLESTIK ABP 8066T, Hybrid chemistry, Die Attach, Highly filled, Conductive Adhesive