LOCTITE® ABLESTIK ABP 8066T

Características e Benefícios

LOCTITE ABLESTIK ABP 8066T, Hybrid chemistry, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8066T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. The material is hydrophobic and stable at high temperatures. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
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Informação Técnica

Aplicações Cravação por afundamento
Coeficiente de expansão térmica (CTE) 53.0 ppm/°C
Coeficiente de expansão térmica (CTE), Above Tg 90.0 ppm/°C
Condutividade térmica 15.0 W/mK
Temperatura de transição do vidro (Tg) 67.0 °C
Tipo de cura Cura por Calor
Viscosidade, Brookfield CP51, @ 25.0 °C Speed 5 rpm 10000.0 mPa.s (cP)
Índice tixotrópico 6.0