LOCTITE® ABLESTIK ABP 8066T
Vlastnosti a výhody
LOCTITE ABLESTIK ABP 8066T, Hybrid chemistry, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8066T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. The material is hydrophobic and stable at high temperatures. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
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Technické informace
| Aplikace | Připevnění formy |
| Koeficient tepelné roztažnosti (CTE) | 53.0 ppm/°C |
| Koeficient tepelné roztažnosti (CTE), Above Tg | 90.0 ppm/°C |
| Tepelná vodivost | 15.0 W/mK |
| Teplota skelného přechodu (Tg) | 67.0 °C |
| Tixotropní index | 6.0 |
| Viskozita, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 10000.0 mPa.s (cP) |
| Způsob vytvrzování | Vytvrzování teplem |
LOCTITE® ABLESTIK ABP 8066T
LOCTITE ABLESTIK ABP 8066T, Hybrid chemistry, Die Attach, Highly filled, Conductive Adhesive