LOCTITE® ABLESTIK ABP 8066T
Vlastnosti a výhody
LOCTITE ABLESTIK ABP 8066T, Hybrid chemistry, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8066T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. The material is hydrophobic and stable at high temperatures. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
| Aplikácia | Pripevnenie formy |
| Koeficient tepelnej rozťažnosti (CTE) | 53.0 ppm/°C |
| Koeficient tepelnej rozťažnosti (CTE), Above Tg | 90.0 ppm/°C |
| Spôsob vytvrdzovania | Vytvrdzovanie teplom |
| Tepelná vodivosť | 15.0 W/mK |
| Teplota priepustnosti skla (Tg) | 67.0 °C |
| Tixotropný index | 6.0 |
| Viskozita, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 10000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 8066T
LOCTITE ABLESTIK ABP 8066T, Hybrid chemistry, Die Attach, Highly filled, Conductive Adhesive